Student Research Projects
Dielectric Test Panel Fabrication
Sponsored by:
TRW Avionics Systems Division/ Space and Electronics Group
3/25/97
Dr. James S. Burns
Co-Principal Investigator
Department of Mechanical Engineering
San Diego State University
San Diego CA 92182-1323
Objectives
San Diego State University was contracted to fabricate
and evaluate the processing of a group of low-loss Cyanate-Ester and
Epoxy resin screening plaques. These materials it was hoped, once mixed
with a ferroelectric ceramic filler, would produce samples with a dielectric
constant of around 15-20 and a low tan. Measurement of loss tangent
and dielectric constant by TRW will determine if fabrication of additional
specimens is warranted. A "process lessons learned" record
was requested by the sponsor to facilitate transition of technology
to TRW.
Background
An epoxy resin was included in this study as a baseline
matrix material because previously measured dielectric data exists within
TRW and because epoxies have the potential for process flexibility and
good compatibility with film bonding tapes. Cyanate-Ester resin was
selected as a second candidate by TRW through experiences with this
and other systems in previous development efforts. Cyanate-Ester was
found previously to exhibit lower dielectric loss (due ostensibly to
lower moisture absorption) when compared with Epoxies and ease of processing
when compared to another potential candidate: flouropolymers. Figure
1 depicts several model predictions for the bulk dielectric constant
of epoxy plaques filled with the CG ferroelectric ceramic powder. A
volume fraction of around 63% filler is needed to reach a dielectric
constant of 20 in the more conservative Maxwell model.

Figure 1. Dielectric Models for 1=2800, 2=3.3
Discussion
The original screening test matrix (see Table 1) included
one epoxy and two cyanate-ester systems at ceramic particle concentrations
of 5, 15, and 25% by volume. The epoxy used was Masterbond product
EP121CL 2-part, low-moisture formulation with =3.3 and =0.013@1MHz.
The two Cyanate-Ester systems were Arocy XU 366 with =2.64 and =0.0004@1MHz
and Arocy M-20; both were from Ciba. Arocy XU 366 and M-20 are single-part
systems designed for use with a catalyst. The CG Ferroelectric ceramic
powder is graded at 1 micron and has a reported =3.3 and =0.013@up to
several GHz. Additional physical data for the materials is presented
in Table 2.
Table 1. Original Test Plan
|
Matrix
|
Plaques
|
Filler
|
Catalyst
|
| EP121CL epoxy |
1
|
None |
None |
| EP121CL epoxy |
1
|
Ceramic 1@5% |
None |
| EP121CL epoxy |
1
|
Ceramic 1@15% |
None |
| EP121CL epoxy |
1
|
Ceramic 1@25% |
None |
| XU-Cyanate |
1
|
None |
None |
| XU-Cyanate |
1
|
None |
Recom. 2W% |
| XU-Cyanate |
1
|
None |
5W% |
| M-Cyanate |
1
|
None |
Recommended |
| XU-Cyanate |
1
|
Ceramic 1@5% |
TBD |
| XU-Cyanate |
1
|
Ceramic 1@15% |
TBD |
| XU-Cyanate |
1
|
Ceramic 1@25% |
TBD |
| M-Cyanate |
1
|
Ceramic 1@5% |
TBD |
| M-Cyanate |
1
|
Ceramic 1@15% |
TBD |
| M-Cyanate |
1
|
Ceramic 1@25% |
TBD |
Table 2. Material Physical Properties
| Symbol |
Value |
Units |
Information (source) |
|
c
|
8 |
g/cc |
density of ceramic (supplier) |
|
e
|
1.30 |
g/cc |
density of epoxy (supplier) |
|
|
cy1
|
1.14 |
g/cc |
density of first cyanate ester (supplier) |
|
|
cy2
|
1.13 |
g/cc |
density of second cyanate ester (supplier) |
|
|
vt
|
81.9 |
cc |
nominal volume of plaque (meas.) |
|
|
t
|
0.305 |
cm |
nominal plaque thickness (meas.) |
SDSU's original plan was to produce 12"x12" plaques for
later cutting into 6" squares. A flat-platen tool previously
constructed from scrap material for another program was layered with
titanium foil to provide a smooth finish for part molding. Mr. Rob
Riddle at TRW suggested that plaques in the range 0.075" to 0.125"
thickness offer acceptable mechanical strength. The 12"x12"
plaque size proved a waste of material during the learning phases
of the work and was abandoned in favor of the 6" x 6" plaque
size produced from the depicted picture-frame insert.
Processing Techniques
All work would be made much easier with access to complete
cure information on each resin product, but the suppliers are seldom
responsive in this area. All processing was carried out in a well ventilated
room. All personnel wore latex gloves. A custom processing apparatus
was fabricated from spare lab equipment to permit control of the temperature
and degree of mixing of reacting polymers while under vacuum. Vacuum
is required to remove trapped air introduced with the fillers or later
during relatively high-speed, convective mixing of the suspension. It
consists of an evacuated glass bell jar, a fixtured aluminum base-plate
for the jar with integral vacuum and electrical pass-throughs, a DC
stirring motor, a shaft mounted mixing impeller, a speed controller,
a regulated hot plate, a thermocouple reader and a vacuum pump.
Epoxy Processing
The minimum viscosity of the suspension at process temperatures
ultimately determined the suitability of any potential processing methods.
Filled plaques required compression-assisted molding to complete the
formation of flat plaques prior to gelation of the matrix. This is because
particulate fillers greatly increase the apparent viscosity of a fluid.
Casting, rather than compression-assisted molding was used for all the
unfilled plaques. Because direct measurement of viscosity is seldom
possible during processing, several observational trials were made to
visually gage the decrease in viscosity associated with heating the
polymers. Figure 2 depicts a visual "degree of gelation" graph
for neat epoxy.

Figure 2. Gelation Observations
The degree of gelation observed was corroborated by motor
controller current data provided by the motor controller readout. For
a constant voltage, motor current is a reliable indirect indicator of
viscosity. This data will not be reported because of its dependence
on the exact apparatus used for processing. Notice the small meniscus.
When the normally much deeper meniscus starts to decrease in depth for
a constant motor voltage, gelation is immanent and the suspension should
be removed at once and spooned into the plaque mold.
Cyanate-Ester Processing
Processing of the XU366 resin was approached in much the
same way as that for EP121CL. The most important difference between
the two in processing is the much more rapid increase in viscosity observed
for the cyanate systems near gelation. This presents a problem in determining
the time to remove the suspension from the process apparatus. Several
runs ended with solid polymer in the apparatus. Once a late stage increase
in viscosity is noted for these systems, they must be removed immediately
and spooned into the mold. Any delay is catastrophic.
Plaque Mechanical Data
The EP121CL epoxy plaques (denoted "E") that
SDSU delivered to TRW are marked with E5, E10, E25, etc. Physical data
for these plaques is found in Table 3. The number after "E"
is the weight percentage of filler; the volume percentages are only
0.8%, 1.5% and 5.1%. Additional specimens at 35% and 50% by weight were
fabricated and delivered to TRW. One specimen with 75% by weight, which
is roughly 40% by volume, was discarded due to its lack of integrity.
Flexural modulii were measured for many of the plaques.
Table 3. Plaque Physical Data
| Code |
Matrix |
Plaque Weight |
Density |
Filler Weight fraction |
Filler Volume fraction |
| E |
Epoxy 1 |
72
|
1.3
|
0.0%
|
0.0%
|
| E5 |
Epoxy 1 @ 5% |
107
|
1.35
|
4.8%
|
0.8%
|
| E10 |
Epoxy 1 @ 10% |
112
|
1.42
|
10.0%
|
1.8%
|
| E25 |
Epoxy 1 @ 25% |
139
|
1.64
|
25.0%
|
5.1%
|
| E35 |
Epoxy 1 @ 35% |
166.0
|
1.63
|
35.0%
|
18.6%
|
| C |
Cyanate 1 w/o catalyst |
47
|
1.14
|
0.0%
|
0.0%
|
| CC |
Cyanate 1 w/ catalyst |
95
|
1.14
|
0.0%
|
0.0%
|
| C5C |
Cyanate 1 w/ 5% cat. |
96
|
1.19
|
5.0%
|
0.7%
|
Plaque Dielectric Data
Dielectric property measurement performed at TRW and relayed
to SDSU by Fax in January of 1997 is presented in Figure 3. The unfilled
plaque verifies the product data. The plaques with 5 and 10% catalyst
appear lossy and their dielectric constant values do not correlate well
with their filler concentrations.

Figure 3. Dielectric Data for Filled Epoxy @2Ghz.
Additional Issues
A number of side issues such as filler-settling-induced
concentration gradients, catalyst concentration v. dielectric properties,
etc. were of notable addressed. Concentration gradients through the
thickness may be a desirable way to reduce dielectric mismatch and associated
plane reflection effects. Such a "functional gradient" material
was produced accidentally. At low filler concentrations the effective
suspension viscosity was too low (for either polymer) to retain the
particles in suspension for the entire pre-gel phase of processing.
An early plaque, made by casting, showed pronounced settling and stratification
of the filler as evidenced by gross curling due to differential shrinkage
of different strata. This method of producing a "functional gradient"
produces too many side effects. Multiple layer casting of progressively
denser layers may prove more feasible.
Catalyst concentration was varied to explore its influence
over dielectric behavior. Since the recommended catalyst for the Arocy
systems is a zinc additive, the loss tangent was expected to increase
with increasing catalyst concentration. This is confirmed by the TRW
generated data in Figure 4. The dielectric constant is seen to decrease
for increasing catalyst concentration.

Figure 4. The Influence of Catalyst Concentration on Dielectric
Properties
Recommendations
Standard Plaque Molding Guidelines
- Clean Mold Parts with ScotchBright Pad, Solvent, Clean Cloth
- Apply Lilly Industries Mold Release 225 Release Or Similar To All
Tooling
- Air Dry 5 Minutes
- Heat Polymer To 300°F To Lower Viscosity
- Hold For 5 Minutes
- Stir In Ceramic Powder Slowly While Maintaining Temperature
- Mix In Vacuum On Hot Plate For 5 Minutes
- Observe Meniscus Of Epoxy During Further Stirring; Cycle Vacuum
- When Meniscus Begins To Flatten Remove Material Quickly From
Heat
- Spoon Into Mold
- Insert Thermocouple Into Mold
- Press For 4 Hours At 300°F
- Cool Without Pressure
- Demold
Conclusions
This work successfully demonstrated laboratory-scale methods
for compression molding polymer suspensions of interest in signature
reduction programs. Further refinements to process procedures are certainly
attainable. Scale-up will be limited by equipment fabrication, polymer
temperature control and batch size effects, and timing of the gel point.
The ferroelectric filler of interest appears to fail to produce the
expected bulk composite properties for which it was chosen. Catalyst
concentration demonstrated a significant influence over the loss tangent
of the XU366 system.
Appendix A